In-Vehicle high-speed media transmission chip interconnection test and verification activity successfully held
From September 23 to 27, 2024, the "Interoperability Testing and Verification Activity for High-Speed Media Transmission Chips in Vehicles" was successfully held in Tianjin. This event was jointly organized by the China Automotive Chip Standard Testing and Certification Alliance (CACC) and the National Technology Standards Innovation Base (Automotive) (hereinafter referred to as the "Innovation Base"), and co-hosted by China Automotive Technology & Research Center Software Testing (Tianjin) Co., Ltd. and Motorcomm Electronic Technology Co., Ltd. More than ten participating organizations, including vehicle manufacturers and chip companies, joined the event.
The event was conducted in accordance with the automotive industry standard "Automotive wired high-speed media transmission—Multi-gigabit full duplex system—Technical requirements and test methods." It focused on verifying the standard compliance of chips and testing the interoperability between multiple chips, aiming to improve interoperability testing technologies, explore standardization directions, and collectively promote the healthy development of the industry application ecosystem.
In the future, the CACC and the Innovation Base will leverage their respective strengths to jointly drive technological innovation and the coordinated development of estate applications, thereby advancing the high-quality development of the automotive chip industry.
