High-speed media transmission chip interconnection test workshop and the first meeting of the HSMT working group successfully held
On October 28, 2025, during the "2025 Automotive Chip Ecosystem Conference and Annual Meeting of the China Automotive Chip Standard Testing and Certification Alliance," the High-Speed Media Transfer (HSMT) Interoperability Testing Technology Seminar and the first meeting of the HSMT Working Group were successfully held. Representatives from over 30 companies, including Yingwang, Changan, FAW, BYD, Geely, BAIC, Leapmotor, Sinotruk, HISENSE, Norelsys, New Port Coast, NXP, Motorcomm, 3peak, Zhenxin, Joywell, TI, Rohm, Infineon, SmartSens, Southchip, Renchip, Venlinktech, OmniVision, Silergy, Waliyuan, GBIT, and Shisheng, attended the event.
The conference focused on core topics such as ecosystem development, technology research and development, and testing and certification in the HSMT field, establishing an efficient platform for industry communication and collaboration. The lead organization of the working group, China Automotive Chip, reported on the progress of HSMT ecosystem development. The report highlighted three key areas: first, strengthening the technology R&D system, focusing on chip development and testing technology improvements, and promoting implementation and verification to form a closed-loop of "R&D-testing-application"; second, conducting product testing and certification to create a "passport" for market access and a "gold standard" for quality; and third, building a win-win industry ecosystem by collaborating with key partners across the industry chain to establish a community of shared development and consolidate and expand industry advantages.
During the meeting, the five sub-groups of the HSMT Working Group each presented their work progress and future plans. Experts and participants, drawing on industry practices and their own experiences, engaged in in-depth discussions on the consistency and interoperability specifications of HSMT audio and video protocols, the next-generation evolution of HSMT audio and video technologies, and the consistency and interoperability specifications for connectors and cables in HSMT audio and video transmission. The atmosphere was lively and engaging.
After the meeting, the experts and company representatives visited the HSMT automated testing system and the multi-vendor interoperability testing platform.
Figure 1: HSMT Video Chip Interoperability Testing
Figure 2: HSMT Video Chip Automated Testing System
Figure 3: HSMT Audio Chip Interoperability Testing
Figure 4: HSMT Audio Chip Automated Testing System
Figure 5: Group photo of the HSMT Working Group